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Image Search Results
Journal: Materials
Article Title: Surface Morphology Evolution during Chemical Mechanical Polishing Based on Microscale Material Removal Modeling for Monocrystalline Silicon
doi: 10.3390/ma15165641
Figure Lengend Snippet: Surface area–volume model simulation of two neighboring parabolic cracks (thick line) and Gaussian fitting results (thin line) in 2D. The etching rate for bulk silica material was 1.74 μm/h , and the etching time was 1–5 h.
Article Snippet: The
Techniques:
Journal: Materials
Article Title: Surface Morphology Evolution during Chemical Mechanical Polishing Based on Microscale Material Removal Modeling for Monocrystalline Silicon
doi: 10.3390/ma15165641
Figure Lengend Snippet: RMS roughness evolution for 17,550 loops with Gaussian blur over the entire surface. The curve is nonconvergent for one abrasive per loop with quasilinear growth after 4000 loops.
Article Snippet: The
Techniques:
Journal: Materials
Article Title: Surface Morphology Evolution during Chemical Mechanical Polishing Based on Microscale Material Removal Modeling for Monocrystalline Silicon
doi: 10.3390/ma15165641
Figure Lengend Snippet: SiO 2 ASD test by DLS, with a Gaussian-type fitting mode (red solid line); peaks at 2.8 and 107.2 nm for the bimodal ASD curve.
Article Snippet: The
Techniques: